北京工业大学材料学院汉晶副教授

kongjun555

汉晶，女，汉族，山东日照人，工学博士。2002/09-2006/07，就读于哈尔滨工业大学，焊接技术与工程系，获工学学士；2006/09-2008/07，就读于哈尔滨工业大学，深圳研究生院，获工学硕士；2008/09-2013/01，就读于哈尔滨工业大学，深圳研究生院，获工学博士。于2013年8月起，受聘于北京工业大学材料学院。先后主持国家自然科学基金青年基金、北京市自然科学基金面上项目和北京市教委科技计划等纵向项目。目前的主要研究方向：先进电子封装材料与技术；互连焊点可靠性；焊点界面反应。承担本科生及研究生课程教学任务。欢迎化学或数学方面有特长的材料相关专业硕士生加入课题组。


Email: hanjing@bjut.edu.cn    Tel: 010-67396614


Most Recent Publications:
(1) J. Han*, F. Guo, J.P. Liu, Early Stages of Localized Recrystallization in Pb–Free BGA Solder Joints Subjected to Thermomechanical Stress, J. Alloys Compd. 704 (2017) 574–584.
(2) J. Han*, F. Guo, J.P. Liu, Recrystallization Induced by Subgrain Rotation in Pb–free BGA Solder Joints Under Thermomechanical Stress, J. Alloys Compd. 698 (2017) 706–713.
(3) J. Han*, F. Guo, J.P. Liu, Effects of Anisotropy of Tin on Grain Orientation Evolution in Pb–free Solder Joints Under Thermomechanical Stress, J. Mater. Sci. Mater. Electron. (2017). doi:10.1007/s10854-017-6347-2.
(4) J. Han*, S.H. Tan, F. Guo, Study on Subgrain Rotation Behavior at Different Interfaces of a Solder Joint during Thermal Shock, J. Electron. Mater. 45 (2016) 6086–6094.
(5) S.H. Tan, J. Han*, F. Guo, Subgrain Rotation at Twin Grain Boundaries of a Lead–Free Solder Joint during Thermal Shock, J. Mater. Sci. Mater. Electron. 27 (2016) 9642–9649.
(6) Y. Wang, J. Han, L. M. Ma, Y. Zuo, F. Guo*, Electromigration Behaviors of Cu Reinforced Sn–3.5Ag Composite Solder Joints, J. Electron. Mater. 45 (2016) 6095–6101.
(7) P.H. Gu, J. Han, F. Guo*, Effects of Nano-Structured Reinforcements on the Recrystallization and Damage Mode of Sn–3.0Ag–0.5Cu Solder Joints, 17th International Conference on Electronic Packaging Technology, Aug. 2016.